Vacuum-soldering for high-quality production
The power density of advanced electronic components like e.g. power modules, hybrid and multichip components, etc. is continuously growing. Therefore, the quality of solder connections must fulfill the increasing demands as well. Gas inclusions (= voids) in the solder connections must be avoided.
The best way to remove such from the liquid solder is the systematic use of vacuum during the soldering process.
For R&D and small series production Compact and reliable The compact soldering system VADU 100 is equipped with separate zones for soldering and cooling and can be operated with paste as well as preforms. Due to its small dimensions and the easy operation, the batch system is very suitable for production of small series and […]
Soldering of substrates and wafers in series production The soldering system of type VADU200XL is equipped with two separate process chambers and can be operated with paste as well as preforms. This allow the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling. Due to its intelligent temperature management […]
Soldering of substrates and wafers in series production The soldering system of type VADU 200XL-W is equipped with two separate process chambers and can be operated with paste as well as preforms. The VADU 200XL-W enables the soldering of wafers up to 12 inch. Customized carriers are also offered by PINK. This system allows the […]
Automated inline soldering system for series production The soldering system VADU 300XL is equipped with three separate process chambers with internal substrate handling and inline carrier transfer for highly efficient series production. The system enables void-free solder connections with preforms and /or pastes in a continuous process. The reproducibility of the soldering processes is guaranteed […]
Automated inline soldering system for series production The soldering system VADU 400XL is equipped with four separate process chambers with internal substrate handling and inline carrier transfer for highly efficient series production. The system enables void-free solder connections with preforms and /or pastes in a continuous process. The reproducibility of the soldering processes is guaranteed […]
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