High Definition Inspection Cameras BGA Inspection Systems
W30x EasyView 4K Camera Cost effective, plug-and-play and ergonomic video inspection system producing bright pictures for fast and reliable optical inspection. Focusing on the ergonomic and work environment of the user our optical inspection cameras and systems make your daily inspection needs easy, quick and efficient. The W30x-4K has a powerful 30x optical zoom, 70mm […]
Cost effective, plug-and-play and ergonomic video inspection system producing bright pictures for fast and reliable optical inspection. Focusing on the ergonomic and work environment of the user our optical inspection cameras and systems make your daily inspection needs easy, quick and efficient. The W30x-4K has a powerful 30x optical zoom, 73mm to 500mm working distance […]
The Optilia Extensive BGA system produces high-resolution digital pictures with excellent colour and detail definition. It creates sharp images of solder balls under BGA packages up to 10 rows and to 40 µm component stand-off. Magnification of the lenses can be changed from approximately 5x (~50 mm working distance) to 350x (~ 0.3 mm working […]
The Flexia XYZ-Measuring system is a technically competitive 3-axis non-contact dimensional measurement of geometry in electronics production and quality control. Designed for visual inspection, digital image recording, dimensional software measurement, documentation and reporting. Flexia Vision measurement consists of the mobile Flexia D1 ESD digital microscope, high quality optical lenses, high intensity adjustable LED illumination, robust […]
The new ‘XL’ kit has been configured in response to market demand and targets users who regularly inspect larger boards. The XL kit fits into the range over the current top-of-the-line Optilia Extensive BGA inspection kit. The key feature for improving the handling of larger boards is the inclusion of the extra large double-boom stand. […]
The Optilia Extensive BGA system produces high-resolution digital pictures with excellent colour and detail definition. It creates sharp images of solder balls under BGA packages up to 10 rows and to 40 µm component stand-off. Magnification of the lenses can be changed from approximately 5x (~50 mm working distance) to 350x (~ 0.3 mm working […]
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